JCAA/JG-PP LEAD-FREE SOLDER PROJECT: -20°C to +80°C THERMAL CYCLE TESTAuthors: Thomas A. Woodrow, Ph.D.
Company: Boeing Phantom Works
Date Published: 9/24/2006 Conference: SMTA International
The solder alloys selected for test were:
Sn3.9Ag0.6Cu for reflow and wave soldering
Sn3.4Ag1.0Cu3.3Bi for reflow soldering
Sn0.7Cu0.05Ni for wave soldering
Sn37Pb for reflow and wave soldering
Test vehicles were assembled using these solders and a variety of component types and the test vehicles are being thermally cycled (from -20°C to +80°C). To date, 11,100 thermal cycles have been accumulated.
The solder joints on the components are being electrically monitored using event detectors and any solder joint failures are recorded on a Labview-based data collection system. The failures of a given component type attached with SnPb solder will be compared to the failures of the same component type attached with lead-free solders by using Weibull analysis.
Key Words: thermal cycling, lead-free solders, reliability
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