SMTA International Conference Proceedings


JCAA/JG-PP LEAD-FREE SOLDER PROJECT: -20°C to +80°C THERMAL CYCLE TEST

Authors: Thomas A. Woodrow, Ph.D.
Company: Boeing Phantom Works
Date Published: 9/24/2006   Conference: SMTA International


Abstract: Thermal cycle testing is being conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JGPP) Lead-Free Solder Project. The JCAA/JG-PP Consortium is the first group to test the reliability of leadfree solder joints against the requirements of the aerospace/military community.

The solder alloys selected for test were:

Sn3.9Ag0.6Cu for reflow and wave soldering
Sn3.4Ag1.0Cu3.3Bi for reflow soldering
Sn0.7Cu0.05Ni for wave soldering
Sn37Pb for reflow and wave soldering

Test vehicles were assembled using these solders and a variety of component types and the test vehicles are being thermally cycled (from -20°C to +80°C). To date, 11,100 thermal cycles have been accumulated.

The solder joints on the components are being electrically monitored using event detectors and any solder joint failures are recorded on a Labview-based data collection system. The failures of a given component type attached with SnPb solder will be compared to the failures of the same component type attached with lead-free solders by using Weibull analysis.

Key Words: thermal cycling, lead-free solders, reliability



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