PROCESS CHARACTERIZATION FOR THE ASSEMBLY OF 01005 COMPONENTSAuthors: Ashok Viswanathan, Krishnaswami Srihari, Ph. D., a
Company: Binghamton University and DEK USA Inc.
Date Published: 9/24/2006 Conference: SMTA International
The volume of solder paste transferred, considering the small apertures and low area ratio, is a critical factor in fine pitch printing. The consistency of the paste deposited and the transfer efficiency should also be closely monitored. In this research, the design for the stencil accounted for the above factors before deciding on the stencil thickness and aperture dimensions. Tests were carried out with both leadrich and lead-free solder pastes. A suitable measurement technique for the inspection of solder paste volume through an Automatic Optical Inspection (AOI) system was employed. Design of Experiments (DOE) based tests were devised to evaluate the effect of the different factors on the volume of solder paste transferred. Theoretical knowledge was used to support the various assumptions made during the experiment. The goal was to identify a suitable process window based on different materials used, process parameters and external factors. Additionally, the study resulted in identifying critical printer parameters to obtain an acceptable transfer efficiency and repeatability for solder paste deposits for 01005 devices.
Keywords: 01005 devices, Area Ratio, Passives, Transfer Efficiency
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.