USING UNDERFILLS TO ENHANCE DROP TEST RELIABILITY OF Pb-FREE SOLDER JOINTS IN ADVANCED CHIP SCALE PACKAGESAuthors: Brian Toleno, Ph.D., Dan Maslyk, and Tom White
Company: Henkel Corporation
Date Published: 9/24/2006 Conference: SMTA International
Just as underfill materials have provided stability to CSP devices for failures arising from higher temperature leadfree processing requirements, new testing has recently revealed that certain types of underfills also provide protection against failure during board flexure from drop test.
In this paper we compare the reliability of two different sized area array components: 0.4mm pitch wafer level chip scale packages (WLCSP) and 0.5 mm pitch chip scale package (CSP). The reliability of these devices, in both Sn/Pb and lead-free assemblies are evaluated using industry standard drop test methodology. The improvement of the reliability of these devices thorough the use of underfill systems is also demonstrated.
Key words: underfill, reliability, WLCSP, drop testing
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