LEAD-FREE SOLDER ASSEMBLY FOR MIXED TECHNOLOGY CIRCUIT BOARDSAuthors: David Suraski and Karl Seelig
Date Published: 9/24/2006 Conference: SMTA International
The issue of choosing a wave/selective solder alloy is more complicated than choosing an SMT alloy because not only must these solders form a reliable solder joint, but they also are used in a molten solder bath, where various interactions can impact manufacturing and reliability. This paper will provide an in-depth discussion of several issues related to lead-free solder alloy selection for mixed technology circuit board assembly, including: how these alloys react to molten solder baths; copper corrosion and appearance; “hot tears/shrink holes”; voiding; surface cracking; crosscontamination characteristics (the compatibility of these alloys with SAC305 and tin-lead); thermal cycling and shear testing characteristics.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.