SMTA International Conference Proceedings


Author: Olli Salmela
Company: Nokia Networks
Date Published: 9/24/2006   Conference: SMTA International

Abstract: In this paper, the acceleration factors for lead-free solder materials are discussed. The focus is on the analytical models proposed by Norris-Landzberg, Pan, and Salmela. As most reliability prediction models are originally created for eutectic SnPb solder material, it is expected that the models must be re-calibrated in order to be useful in conjunction with lead-free solder materials.

Pan et al have re-parameterized the Norris-Landzberg’s model for SnAgCu already earlier. However, the data provided by Syed did not fit very well the reparameterized Norris-Landzberg model. An approach to explain this, and a benchmark of results based on alternative parameter value selections, is presented. The underlying assumptions related to the Norris-Landzberg’s model and the applicability of the model in case of leadfree solders is discussed. Finally, an alternative form of Norris-Landzberg’s equation is introduced and the fit of the existing experimental data to the proposed model is studied.

Keywords: lead-free, solder, reliability, acceleration factor.

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