ACCELERATION FACTORS FOR LEAD-FREE SOLDER MATERIALSAuthor: Olli Salmela
Company: Nokia Networks
Date Published: 9/24/2006 Conference: SMTA International
Pan et al have re-parameterized the Norris-Landzberg’s model for SnAgCu already earlier. However, the data provided by Syed did not fit very well the reparameterized Norris-Landzberg model. An approach to explain this, and a benchmark of results based on alternative parameter value selections, is presented. The underlying assumptions related to the Norris-Landzberg’s model and the applicability of the model in case of leadfree solders is discussed. Finally, an alternative form of Norris-Landzberg’s equation is introduced and the fit of the existing experimental data to the proposed model is studied.
Keywords: lead-free, solder, reliability, acceleration factor.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.