RELIABILITY STUDY OF LEAD-FREE AREA ARRAY PACKAGES WITH TIN-LEAD SOLDERING PROCESSESAuthors: Jennifer Nguyen, David Geiger, Daniel Rooney, Ph.D
Company: Flextronics International
Date Published: 9/24/2006 Conference: SMTA International
Key Words: reliability, lead-free, SnAgCu alloy, mixed alloy, backward compatibility, backward compatible assembly, tin percentage, reflow temperature.
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