SMTA International Conference Proceedings


RELIABILITY STUDY OF LEAD-FREE AREA ARRAY PACKAGES WITH TIN-LEAD SOLDERING PROCESSES

Authors: Jennifer Nguyen, David Geiger, Daniel Rooney, Ph.D
Company: Flextronics International
Date Published: 9/24/2006   Conference: SMTA International


Abstract: In an earlier study1 we reported the mixed alloy solder joint metallurgy and the lead (Pb) distribution through the solder joint for different package types and under various process conditions. The results showed that the solder paste amount (ultimately tin percentage in the alloy) and the reflow temperature play critical roles in the mixed alloy assembly, both in terms of compositional homogeneity and voiding. This paper focuses on the reliability of mixed alloy solder joints at various process conditions, under different thermal and mechanical stress environments.

Key Words: reliability, lead-free, SnAgCu alloy, mixed alloy, backward compatibility, backward compatible assembly, tin percentage, reflow temperature.



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