SMTA International Conference Proceedings


ELECTRICAL LEAKAGE FAILURES DUE TO ENTRAPPED FLUX BELOW A QFN PACKAGE

Author: Terry Munson
Company: Foresite
Date Published: 9/24/2006   Conference: SMTA International


Abstract: Flat leadless QFN package can trap flux from no-clean solder paste leaving a gooey, conductive residue between the back of the leads and the ground pad.

Development of new packaging technology goes through many issues to get to the production floor, but as product get brought into the assembly process different issues and impacts occur when put on to a high volume production process. We continue to learn about our process, the component packages, the thermal impacts, the flux spread and the reliability impacts of all we do to assembly the hardware. All components go through this development and understanding the issues for each manufacturer to learn the issues of how to place an 0201 or a microBGA with 1700 I/O.



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