CONTROL OF THE WARPAGE FOR PACKAGE-ON-PACKAGE (PoP) DESIGNAuthors: Wei Lin, Akito Yoshida, Moody Dreiza, Takahiro Yam
Company: Amkor Technology and Ibiden Co., Ltd.
Date Published: 9/24/2006 Conference: SMTA International
We systematically studied the warpage control for the bottom package by both experiments and finite element simulations with all possible design parameters and material sets. We did design of experiment (DOE) and measured the actual warpage of package at room temperature and also at reflow temperature using shadow moiré method. In parallel, finite element model simulation were carried out to correlate with the empirical results and help understand the effects of critical package parameters for warpage control. By optimizing design parameters and material set, the package warpage could be well controlled within specifications. In the paper, we will present the warpage test data and simulation data. The effects of die size, mold compound material and thickness, substrate thickness, and die attach material will be discussed in depth.
Key words: 3D packaging, PoP, warpage
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