Surface Mount International Conference Proceedings


Author: R. Aschenbrenner
Company: Fraunhofer-Institut
Date Published: 9/10/1996   Conference: Surface Mount International

Abstract: An increasing number of flip chip interconnection technologies have emerged during the last few years. While flip chip assembly in combination with MCM’S offers many advantages, several aspects prevent this technology from entering the high volume market. Among these are the limited availability of bumped chips and the costs for the substrates with matching coefficient of thermal expansion to the chip. Actually, many of these problems have been solved to a satisfactory degree. This paper presents some novel approaches to flip chip technology, implementing ball bumping with existing wire bond equipment. Based on this technology, the application of soldering techniques as well as adhesive joining is shown. The specific requirements of flip chip assembly for BGA-packages are shown. The reliability evaluation was performed with specific regard to the metallurgical degradation in solder joints and to the interface reactions between polymers and metal surfaces in adhesive contacts. The electrical and mechanical performance of the solder and adhesive bonds was studied by evaluating initial contact resistance and mechanical adhesion as a function of temperature and humidity. The successful implementation of ball bumping in combination with soldering and adhesive joining is the result of the studies presented in this paper.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819