COOLING RATE OPTIMIZATION AND RELIABILITY OF Pb-FREE Sn-Ag-Cu STACKED BGA MODULESAuthors: R. Kinyanjui, M. Abtew1 and K. Sprinkle
Company: Technology Development Center (TDC), Viking Interw
Date Published: 9/24/2006 Conference: SMTA International
This paper presents the results of an experimental study on the effects of cooling rate and multiple-reflows on the reliability of ball grid array (BGA) solder joints. The studies were conducted on the solder joints, both on conventional BGAs attached to printed circuit boards (PCB) assemblies and on Pb-free BGA stacked modules. The assemblies were subjected to isothermal aging and accelerated thermal cycling conditions as well as mechanical shock. The evolution of the solder joints microstructures were examined by cross-sectioning the assemblies followed by observing them using optical and scanning electron microscopy. The characterization of various phases in the solder joint was performed by the use of an energy dispersive spectroscopy (EDS).
Key words: Undercooling, BGA Stack modules, Cooling rate.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.