SMTA International Conference Proceedings


LARGE AREA ARRAY PACKAGE LEAD-FREE REWORK STUDY

Authors: David Geiger, Damone Phanavong, Todd Castello, and
Company: Flextronics International
Date Published: 9/24/2006   Conference: SMTA International


Abstract: Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of electronic components. The HDPUG Consortium conducted a study on the time / temperature profile for reflow for the rework process. The rework of these component types will be evaluated and the key issues such as reflow profiling, adjacent component temperatures, and solder joint formation will be discussed. Results of metallurgical analysis are given to support the success of the process used. These were subsequently used for the build of the GPLF (General Purpose Lead Free) test vehicle to assess reliability of Sn/Ag/Cu solder joints produced.

Key Words: lead-free, SnAgCu alloy, rework, area-array.



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