SMTA International Conference Proceedings


PROCESS FOR BLIND MICROVIA FILLING AND THROUGH HOLE METALLIZATION OF HIGH DENSITY INTERCONNECTS

Author: Bob Gallant
Company: Enthone, Inc., Cookson Electronics
Date Published: 9/24/2006   Conference: SMTA International


Abstract: Microvia technology has gained importance as demands for smaller, lighter and more mobile electronic devices with greater functionality have increased. Microvias are small holes, less than six mils, used to connect innerlayers to outerlayers. Via-in-pad designs, which use blind microvias to connect component lands to innerlayers, must be metallized using similar processes as through holes. The selection of the metallization and copper plating process, which is often left to the discretion of the printed circuit fabricator, can have significant impact on solder joint reliability. This paper discusses new technologies for reliably metallizing and filling blind microvias and through holes simultaneously.



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