“REWORK” TEST VEHICLES OF JCAA/JG-PP LEAD-FREE SOLDER PROJECTAuthor: Ana L. Campuzano-Contreras
Company: BAE Systems
Date Published: 9/24/2006 Conference: SMTA International
The “Rework” test vehicles were designed to assess the impact of using Pb-free components and processes to repair circuit card assemblies designed for assembly with eutectic processes. Eight components, two of each of the following; BGA-225, TQFP-144, DIP-20 and TSOP-50 were selected. The Pb-free solders used were either tin-silver-copper (SAC), tin-silver-copper-bismuth (SACB) or tin-copper (SnCu). Combined environments, vibration, mechanical shock, thermal shock, and thermal cycle (-55°C to +125°C) testing were used to assess the reliability of the joints. Electrical reliability better than or equal to SnPb controls was the acceptance criteria. In summary, rework showed mixed results based on component type and test environments. Additional studies, modeling, and qualifications will be required to establish long term reliability confidence.
Key words: Pb-free, aerospace, military, SnPb, RoHS
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