PROCESS DEVELOPMENT FOR 01005 LEAD-FREE PASSIVE ASSEMBLY: STENCIL PRINTINGAuthors: Joe Belmonte, Vatsal Shah, Rita Mohanty, Ph.D., Ti
Company: Speedline Technologies, Indium Corporation of Amer
Date Published: 9/24/2006 Conference: SMTA International
With the advent of 0201 and most recently 01005 passives components, meeting the area ratio target of 0.66 is a challenging task; especially with a 5 mil thick stencil and a Type 3 powder solder paste. These tiny passive technologies and minimalist IC packages like 0.4mm CSPs have created a need to re-evaluate the area ratio criterion of 0.66 and other related issues.
In light of this need, we developed a series of designed experiments (DOEs) evaluating Type 3 and Type 4 solder pastes, varying aperture designs for 0201, 01005 and 0.4 mm CSPs, and 3 and 4 mil thick laser cut and E-Fab stencils. In these experiments we determined optimum print parameters for the various combinations of pastes, components, aperture design, and stencil fabrication mentioned above. Our results also suggested new criteria for area ratios.
We believe that with the concurrent implementation of leadfree assembly, this work could not be more timely.
Key words: 01005, passives, passive assembly, lead free passive assembly.
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