SMTA International Conference Proceedings


BONDING TECHNIQUES IN WAFER FABRICATION

Author: Karthik Tondapu
Company: Department of Electrical and Communication Enginee
Date Published: 9/24/2006   Conference: SMTA International


Abstract: Fabrication of any micro device can hardly be imagined without making use of some type of wafer bonding or cavity sealing. The field of microfabrication is now a major subject, for both scientific research and industrial applications, in the promising field of micro electro mechanical systems. Wafer bonding advantages include: enhanced throughput, improved yield and possibility of testing device at wafer scale prior to dicing. Wafer bonding is of high importance to MEMS device packaging as it provides a cost reduction through Wafer Level Packaging. It was observed that currently MEMS packaging could correspond to up to 70% of total device costs [1]. The present paper is a review article on the various types of bonding techniques widely used in the field of microfabrication, especially the fabrication of MEMS structures. A discussion on the five main bonding techniques – Anodic, Silicon Fusion, Eutectic, Thermocompression, and Adhesive Wafer Bonding is done in this paper. Finally it is concluded on the comparison of these techniques in terms of bonding conditions, applications and other parameters. Key words:



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819