Medical Electronics Symposium Conference Proceedings


Authors: Jennifer L. David, Ph.D.
Company: GE Advanced Materials – Silicones
Date Published: 9/12/2006   Conference: Medical Electronics Symposium

Abstract: A review of the trends driving growth and innovation in the medical electronics industry highlights several key requirements for next generation assembly materials. This paper will explore these needs in relation to the performance characteristics of several new thermal adhesive products from GE Silicones. One of the most important challenges in medical electronics today is improved heat dissipation. With the increased functionality and faster processing speeds of the next generation of medical equipment, efficient and rapid transport of large quantities of heat away from sensitive electronics will be of utmost importance. The continued miniaturization of medical devices, which enables these products to function as worn or implanted therapy systems, compounds the difficulty of heat transport; in these applications power output increases while package footprints decrease. To address these issues, GE Silicones has developed a new family of thermal adhesives capable of superior heat dissipation in demanding medical applications. These new materials have been used with great success in a recently launched high speed volume computed tomography scanner from GE Healthcare. Of equal importance to thermal management, is the need for long-term reliability and stability of components that are subjected to harsh or uncontrolled environmental conditions. The trend toward in-home and wearable monitoring devices means that the medical electronics of today are no longer kept under carefully maintained hospital or laboratory conditions. To ensure that assembly materials continue to perform as desired, extensive ageing studies and stress testing must be done as a critical piece of the material selection process. The sensitive components of the newest medical devices can present special processing challenges; new solutions will be presented that allow the packaging engineer to reduce package stresses, accommodate electronic parts that cannot withstand temperatures above 80C, and achieve room temperature adhesion in liquid dispense systems. Key words: thermal interface material, thermal adhesive, cure speed, cure temperature

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