NANO SOP FOR ULTRA-MINIATURIZED ELECTRONIC AND BIO-ELECTRONIC SYSTEMS
Authors: Rao Tummala, P. Markondeya Raj, D. Janagama Goud a Company: Packaging Research Center, Georgia Institute of Te Date Published: 1/17/2006
Pan Pacific Symposium
Abstract: Recent advances in the synthesis of nanomaterials with outstanding properties combined with nanofabrication technologies are leading to ultra-miniaturized systems with embedded multifunctions that hold the key to the emergence of bio and electronic systems. Nanopackaging provides this embedded functions with thin film functional components and nanointerconnections in organic boards or packages, and together with SIP modules, nano IC devices, embedded power sources and user interface, leads to multi-functional systems in the short term and mega–function systems in the long run. Some examples of nanopackaging that are now being explored at PRC are nanocomposite and nanoscale thin films for embedded capacitors, magnetic nanomaterials based inductors/antennas, nanobelts and nanoresonators based chemical and biological sensors, nanointerconnects for high-density chip-package, high reliability and high electrical performance chip-package electrical connections. Migrating the SOP technology to nanoscale can lead to integration of the entire bio-wireless-computing system including active and passive components into a single package. This methodology leads to many advantages such as reduced size, reduced interconnect loss due to embedded nature of the active components, increased reliability, reduced power due to lower parasitics and cost due to large area processing. This paper will focus on the nano SOP, spanning from mixed-signal design, multiple- function fabrication and integration of RF, optical, digital and sensor nanocomponents and system reliability.