RELIABILITY OF CHIP ON CHIP PACKAGES USING THERMO-COMPRESSION BONDING TECHNOLOGY BETWEEN Au PLATING BUMPS
Authors: Masamoto Tago, Kenji Nanba, Takashi Miyazaki, Seiy Date Published: 1/17/2006
Pan Pacific Symposium
Abstract: There is Systems in a Package (SiP) that makes a large capacity and a high-density data transmission logic-memory interface that achieves a wide bus making in the purpose and uses fine pitch chip-on-chip (CoC) technology. The problem of the CoC technology is connecting the electrode formed on the circuit using a low temperature and a low bonding force. We have achieved a damage-free connection by thermo-compression bonding technology using Au plating bumps of 50 •m pitch as the CoC connection electrodes. We made a connection at as low a temperature possible by optimizing the bonding parameters through evaluation and changing the material of the bonding stage. Additionally, testing indicated that the package we assembled with the optimized bonding parameter was reliable.