ADVANCED PACKAGE STACKING TECHNOLOGIES - IC Package Qualification Testing for Lead-Free Soldering
Authors: Vern Solberg, Craig Mitchell, and Gordon Gray Company: Tessera, Inc Date Published: 1/17/2006
Pan Pacific Symposium
Abstract: The industry is expecting that IC package developers will furnish innovative solutions to expand functionality and assure higher performance with each new generation of product offering. Simultaneously, companies supplying electronic components to the International market are making a number of material changes in order to achieve compliance with the European Union’s “Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment” (The RoHS Directive). Foremost in achieving compliance, manufacturers will need to adapt solder processes that use alloy compositions that are, to the most part, free of lead. This paper reviews in detail the innovative µZ®-Ball Stack package, a fine-pitch BGA technology and structure, The authors will outline the benefits and demonstrates examples of the technology and present the results of environmental qualification test of several RoHS compliant stacked package combinations. The paper will also offer a look forward to the next generation of package technology, previewing a new micro-contact package methodology being developed by Tessera for higher density package stacking in DRAM, Flash and mixed memory applications.