Pan Pacific Symposium Conference Proceedings


DESIGN OF EMC-INTEGRATED DEVICES FOR WIRELESS SENSOR NETWORKS

Authors: A. Gandelli, D. Monopoli, M. Mussetta, R. E. Zich,
Date Published: 1/17/2006   Conference: Pan Pacific Symposium


Abstract: The next generation of advanced sensors for environmental monitoring will require small devices equipped with wireless features able to guarantee the maximum flexibility in terms of the wide variety of applications they can be devoted on. The behavior of the whole system can be dramatically affected by how the antennas is integrated in the rest of the MCM sensor (e.g. by using the same microelectronic technology and the same organizational design techniques adopted by the rest of the circuitry). Therefore the design technique must take into account these constrains by providing the arrangement not only of the antennas requirements but also those of high frequency stages. In particular all the inductive and capacitive coupling between adjacent structures and components must be efficiently reduced (e.g. improving current design technologies by means of integrated design techniques). By adopting a cluster approach, it is possible to re-arrange functional units inside the device in order to obtain homogeneous blocks. This is an effective solution for mixed design in complex devices (i.e. the design developed by including RF components and antennas in the same numerical and simulation tools) and allows to completely re-define the placement of functions on multi-stacked devices: the design can be divided into small functional unit, generally placed on a single layer. These macro-units can be then integrated with adjacent functional blocks in order to obtain the complex function in the smaller volume for the final 3D device. Moreover, the previous constraints on mixing analog functions (related to sensing features of the system) and RF circuitry can now be relaxed, leading to a simplified design and optimal functional placing. Mixed analog-digital or low-high frequency devices can properly be partitioned and simulation results in a more compact form because the limited volume of each cluster. Nevertheless, clustered devices need a different simulation technique, since there are critical elements that must be examined when dealing with simulation in clustered packed devices, such as the input of the 3D structure and the simulation of the problem in the time domain, to obtain frequency domain information based on time response. Finally the arrangement of all these design technique under the same simulation tool provide a more efficient and effective strategy for reducing cost in large massive industrial production allowing the opening of Large Environmental network market to big players in microelectronics technology.



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