Pan Pacific Symposium Conference Proceedings


Authors: A. Gandelli, F. Grimaccia and R.E. Zich
Company: Politecnico di Milano
Date Published: 1/17/2006   Conference: Pan Pacific Symposium

Abstract: Sensor packaging has been identified as one of the most significant areas of research for enabling sensor usage in harsh environments for several application fields. Research deals not only with robust and resistant packages optimization, but also with electromagnetic performance, and thus it is necessary to address the packaging strategy from the very beginning. Sensing elements require a proper type of packaging to provide protection from the operating environment and to permit electrical interconnection, in the same way that integrated circuits do: the package is only part of the sensor and must be designed to coexist with the entire system, without compromise any function. This paper addresses the development and production strategies necessary to identify the real needs in such a field and try to present the suitable way to enhance industrial performance of high-volumes productions. The challenge to the sensor manufacturers is to provide packaging technologies that make it possible to have the necessary performance and reliability, and keep low assembly costs at the same time. As a result research and knowledge building is necessary to obtain the quality and reliability demanded.

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