Pan Pacific Symposium Conference Proceedings


RELIABILITY TESTING OF 9x9 QFN PACKAGES WITH INTERNAL POWER FOR HARSH ENVIRONMENT ELECTRONICS

Authors: John Evans, Ph.D., Elliot McBride, Charles Mitchel
Company: Department of Industrial & Systems Engineering, Ce
Date Published: 1/17/2006   Conference: Pan Pacific Symposium


Abstract: Automotive electronics are changing at a rapid pace with changes in electronics packaging technology and the introduction of legislation requiring lead free solder for assembly operations. In order to determine the effects of these changes, reliability testing has become increasingly important in the validation of electronics components for the automotive industry. For harsh environments conditions in under the hood applications, the effects of these environments necessitate extensive testing at high temperature to determine the reliability of components. [1] With the move to smaller packages and increased power and temperature requirements for IC packages, suppliers are moving to quad flat no-lead (QFN). To explore the “real world” application of these packages, testing was conducted to determine the effects of internal heat generation within the QFN. Internal heating is caused by power being supplied directly to the package. The direct effect of internal heating is an increase in temperature of the package, which can possibly lead to premature failures in solder joints. In addition, these QFN packages often require high operational current. This paper addresses the impact of high current as it relates to solder joint reliability.



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