FAILURES IN SEMICONDUCTOR DEVICE ENCAPSULATED WITH RED PHOSPHORUS FLAME RETARDANT
Authors: Yuliang Deng and Michael Pecht Company: CALCE Electronic Products & Systems Center, Depart Date Published: 1/17/2006
Pan Pacific Symposium
Abstract: A family of mold compounds with red phosphorus flame retardant was introduced as an environmentally-friendly encapsulant for semiconductor devices. However, these mold compounds induced product failures, including current leakage and resistive shorts between adjacent leads within the package, and resistance increases and open circuits of the wire bonds. This paper presents the family of mold compounds with the red phosphorus flame retardant, the failure mechanisms and the root cause of the failures.