Pan Pacific Symposium Conference Proceedings


FAILURES IN SEMICONDUCTOR DEVICE ENCAPSULATED WITH RED PHOSPHORUS FLAME RETARDANT

Authors: Yuliang Deng and Michael Pecht
Company: CALCE Electronic Products & Systems Center, Depart
Date Published: 1/17/2006   Conference: Pan Pacific Symposium


Abstract: A family of mold compounds with red phosphorus flame retardant was introduced as an environmentally-friendly encapsulant for semiconductor devices. However, these mold compounds induced product failures, including current leakage and resistive shorts between adjacent leads within the package, and resistance increases and open circuits of the wire bonds. This paper presents the family of mold compounds with the red phosphorus flame retardant, the failure mechanisms and the root cause of the failures.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819