EVALUATION OF KEY UNDERFILL FORMULATION PARAMETERS ON THE PERFORMANCE OF FLIP-CHIP DEVICESAuthor: Michael Todd
Company: Dexter Electronic Materials
Date Published: 1/25/2000 Conference: Pan Pacific Symposium
In this paper, we report the results of a series of experiments aimed at identifying the effects of material variabilities on the performance of a high performance flip-chip assembly. An eight-leg Taguchi design (L8) of experiments model was used to generate a series of formulation variations beyond the anticipated inconsistency range of a production qualified underfill formulation. Critical formulation variables were identified based on their effect on both the physical properties of the material and the reliability performance of the flip-chip assembly. The responses were analyzed in terms of the effect on the mean and variation (signal to noise ratio). Several formulation variables had some impact on the formulation’s performance including: Catalyst concentration Filler concentration Moisture concentration
The results of these experiments were used to develop a materials specification which ensures consistent underfill performance. The results were also used for the development of improved control processes for the manufacture of the underfill material.
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