ADVANCES IN JETTING SMALL DOTS OF HIGH VISCOSITY FLUIDS FOR ELECTRONIC AND SEMICONDUCTOR PACKAGING
Author: Alec J. Babiarz Company: Asymtek Date Published: 1/17/2006
Pan Pacific Symposium
Abstract: Jetting adhesives for electronics and semiconductor packaging has provided enabling technology for high throughput underfilling, small fillets, and other applications for small, discrete amounts of material used in packaging. The packaging and electronic component assembly customers are pushing the edge of technology to dispense smaller amounts of adhesives and pastes for assembly of complex packages such as LCOS, OLED, Stacked Packages, DLP chips, head gimbal assemblies, white LEDs and 1 mm flip chip die. This paper will cover the advances and theory of jetting small amounts of viscous materials and the applications that provide enabling technology, new semiconductor packages, LCOS, OLED & light emitting devices, miniature electronic assemblies and MEM devices.