IWLPC (Wafer-Level Packaging) Conference Proceedings


Authors: G. Humpston and D.B. Tuckerman
Company: Tessera, Inc.
Date Published: 11/3/2005   Conference: IWLPC (Wafer-Level Packaging)

Abstract: Tessera, Inc. has developed a novel, hermetic, wafer- level cavity package suitable for image sensors, RF devices and MEMs. Fully packaged die are diced from the completed wafer. Packages have been fabricated using a wide variety of different types of lid materials. The total package height can be less than 75µm overhead on the wafer thickness and the interconnects are formed by soldering. Reliability data for the package indicate it will meet market requirements and cost models predict a substantial price advantage for this style of wafer-level cavity packaging. Examples of CMOS camera die and SAW filters packaged in this manner are presented.

Key words: wafer level package, cavity package, MEMS

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