REPAIRABLE 3D SEMICONDUCTOR SUBSYSTEMAuthor: Peter C. Salmon
Company: Sysflex, Inc.
Date Published: 11/3/2005 Conference: IWLPC (Wafer-Level Packaging)
Reliability is potentially high because conventional cables and connectors are eliminated, the subsystem is mechanically rugged, cooling is improved, and a better integration of heterogeneous chips is provided. The integrated cooling channels support heat dissipations up to 1W/mm2 of chip surface, including optimal allocations of cooling resources to hot spots on a die. Since the flip chip connectors have an inductance ~ 0.1 nH and high-performance interconnections are provided on the copper substrates, signaling rates of at least 20 Gbps for digital signals and 10 GHz for RF signals should be achievable.
Keywords: 3D electronic subsystem, re-workable flip chip, cooling channels, repair-ability, heat bumps, electro-optic connector, stacked BGA, SiP, copper BGA.
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