LOW COHERENCE METROLOGY FOR WAFER LEVEL PACKAGINGAuthors: Wojtek J. Walecki, Talal Azfar, Alexander Pravdivt
Company: Frontier Semiconductor
Date Published: 11/3/2005 Conference: IWLPC (Wafer-Level Packaging)
In this paper we discuss applications of FOLCIRI for wafer level packaging applications. We demonstrate and discuss applications of this technique for metrology of bumped, and stacked wafers. While we report achieved reproducibility of the order of +/- 50 nm, we also discuss fundamental limitations of this technique, and its potential for in-situ applications.
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