IWLPC (Wafer-Level Packaging) Conference Proceedings


Authors: Wojtek J. Walecki, Talal Azfar, Alexander Pravdivt
Company: Frontier Semiconductor
Date Published: 11/3/2005   Conference: IWLPC (Wafer-Level Packaging)

Abstract: Ultra-thin wafer metrology has been identified as one of technology gaps for backend processing of modern thin and ultra-thin devices. Traditional non-contact metrologies such as capacitance gauges cannot be easily adapted to insulating, and ultra-thin wafers. Recently developed fiber optic low coherence infrared interferometry (FOLCIRI) provided solutions to these challenges.

In this paper we discuss applications of FOLCIRI for wafer level packaging applications. We demonstrate and discuss applications of this technique for metrology of bumped, and stacked wafers. While we report achieved reproducibility of the order of +/- 50 nm, we also discuss fundamental limitations of this technique, and its potential for in-situ applications.

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