IN-PROCESS BUMP INSPECTION CAN BOOST YIELDS AND DETECT UNDERLYING PROCESS ISSUESAuthors: Rajiv Roy and Tim Schafer
Company: August Technologies
Date Published: 11/3/2005 Conference: IWLPC (Wafer-Level Packaging)
Keywords: bump inspection, 2D bump inspection, 3D bump inspection, adhesion, connectivity, CD lines, redistribution, post-passivation layer.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.