LEAD FREE BUMPING USING C4NP RELIABILITY AND COST INFORMATION - EXTENDED ABSTRACTAuthor: Klaus Ruhmer et al.
Company: SUSS MicroTec, Inc.
Date Published: 11/3/2005 Conference: IWLPC (Wafer-Level Packaging)
C4NP (C4: Controlled Collapse Chip Connect, NP: New Process) is a novel solder bumping technology developed by IBM and jointly commercialized by IBM and Suss MicroTec. C4NP addresses the limitations of existing bumping technologies by enabling low-cost, fine pitch bumping using a variety of lead-free solder alloys. C4NP is a solder transfer technology where molten solder is injected into pre-fabricated and reusable glass templates (molds). Mold and wafer are brought into close proximity and solder bumps are transferred onto the entire 300mm (or smaller) wafer in a single process step. C4NP technology is capable of fine pitch bumping while offering the same alloy selection flexibility as solder paste printing. This paper reviews the current status of C4NP, including flux-less reflow. It discusses the relevant process equipment technology and a manufacturing cost model.
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