MEAN TIME TO FAILURE IN WAFER LEVEL-CSP PACKAGES WITH SnPb AND SnAgCu SOLDER BUMPSAuthors: Stephen Gee and Luu Nguyen et al.
Company: National Semiconductor
Date Published: 11/3/2005 Conference: IWLPC (Wafer-Level Packaging)
Recommendations for how to measure electromigration in WL-CSP (Wafer Level-Chip Scale Package) solder bumps are also presented. Based upon an analytic model for calculating the resistance change due to solder bump voiding, it was determined that the fractional change in bump via opening should result in an absolute change in resistance, which should be independent of solder bump diameter.
Key Words: Resistivity; Sheet Resistance; Solder Resistance; Eutectic SnPb; SnAgCu; Lead Free; Electromigration; Temperature Sensor.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.