SCALING UP RFID MANUFACTURING – ADDRESSING THE NEED FOR HIGH VOLUME PRODUCTIONAuthor: Gerald Steinwasser
Company: Mühlbauer, Inc.
Date Published: 11/3/2005 Conference: IWLPC (Wafer-Level Packaging)
The great majority of the labels in the market today (all types combined) are manufactured based on flip chip technology and the challenge is how to ramp up to produce tens of billions of smart label inlets a year for a market that already announced the 5-cent label years ago. In the same fashion as the volumes go up, the manufacturing costs (assembly and material) are expected to go down.
Keywords: RFID, smart label, 5-cent label, manufacturing cost, printed antenna, metal antenna, flip chip, RFID inlet
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