DROP TEST PERFORMANCE OF LEAD FREE FBGA PACKAGESAuthor: Flynn Carson & Tae Sung Jeong
Company: STATS ChipPAC Ltd.
Date Published: 11/3/2005 Conference: IWLPC (Wafer-Level Packaging)
In order to better understand and improve the performance of lead free solder with respect to drop test, many factors that influence the drop test performance of lead free FBGA packages were evaluated. One of the most important factors evaluated was different solder ball pad finishes. This study revealed that the solder ball alloy and flux used to apply the ball to the package are significant factors that influence the drop test performance. Such performance is dependent on the pad finish used. Through optimization of lead free solder ball alloy and flux used for each pad finish, robust drop test performance can be demonstrated.
Key words: FBGA, lead free packaging, lead free solder, ball pad finish, flux, drop shock test.
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