ELECTROPLATED COPPER AND COPPER ALLOYS FOR WAFER LEVEL PACKAGINGAuthors: Igor S. Zavarine, Xuan Lin, Chonglun Fan and Yun Z
Company: Enthone - Cookson Electronics
Date Published: 11/3/2005 Conference: IWLPC (Wafer-Level Packaging)
A number of electroplated copper and copper alloys technologies and their application will be compared. Strengths and limitations of different processes as well as criteria for process selections will be presented. Effects of process parameters such as component concentrations, waveform shape, agitation, and surface preparation on bulk properties and surface topologies and ways to manipulate them will be discussed.
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