EVALUATION OF A NANO-PARTICLE METAL AS AN INTERCONNECT FOR ELECTRONICS PACKAGE PROTOTYPINGAuthors: Sungchul Joo and Daniel F. Baldwin
Company: Georgia Institute of Technology
Date Published: 11/3/2005 Conference: IWLPC (Wafer-Level Packaging)
In addition, NPS has a low resistivity as bulk silver enough to be used as an interconnect in electronic packaging, ultimately low leakage current, and relatively high breakdown voltage in conjunction with liquid crystal polymer (LCP). Using NPS, a three dimensional electrical circuit is formed and the chip-first approach is demonstrated for prototype and lowvolume production in micro-system packaging and system in package.
Key words: nano-particle metal, nano-particle silver, interconnect, package prototyping.
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