IWLPC (Wafer-Level Packaging) Conference Proceedings


EVALUATION OF A NANO-PARTICLE METAL AS AN INTERCONNECT FOR ELECTRONICS PACKAGE PROTOTYPING

Authors: Sungchul Joo and Daniel F. Baldwin
Company: Georgia Institute of Technology
Date Published: 11/3/2005   Conference: IWLPC (Wafer-Level Packaging)


Abstract: For the application to an innovative chip-first approach that reduces not only manufacturing cost and lead time and process complexity, but also enhances electrical and mechanical reliability performance, a nano-particle metal (NPM) made of silver is evaluated in terms of mechanical and electrical requirements. The nano-particle silver (NPS) shows an excellent adhesion characteristic to the most common dielectric materials and metals used for electronics packaging.

In addition, NPS has a low resistivity as bulk silver enough to be used as an interconnect in electronic packaging, ultimately low leakage current, and relatively high breakdown voltage in conjunction with liquid crystal polymer (LCP). Using NPS, a three dimensional electrical circuit is formed and the chip-first approach is demonstrated for prototype and lowvolume production in micro-system packaging and system in package.

Key words: nano-particle metal, nano-particle silver, interconnect, package prototyping.



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