THE DEVELOPMENT OF BALLING TECHNOLOGIES FOR WAFER LEVEL DEVICES WITH PITCHES DOWN TO 0.4MM (Conducted as part of the Blue Whale Consortium Project)Author: Mark Whitmore et al.
Company: DEK Printing Machines Limited
Date Published: 11/3/2005 Conference: IWLPC (Wafer-Level Packaging)
This paper details work undertaken to combine the benefits of standard stencil printer technology with that of solid solder sphere placement to enable the development of a low cost, flexible system for the bumping of wafer level packages.
Key Words: Bumping, wafer-level balling, chip scale packaging, ball placement.
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