ELECTRONICS ON DEFORMABLE ULTRA-THIN SUBSTRATESAuthor: M. Bartek et al.
Company: Delft University of Technology
Date Published: 11/3/2005 Conference: IWLPC (Wafer-Level Packaging)
The results show that the cracks appear first in the dielectric layers in-between the silicon layer segments and only at higher loads propagate or are initiated within the silicon itself. The development of first cracks depends significantly on the silicon-layer segmentation dimensions. This affects both the crack density and the crack width. On optimized structures under the bending tests, no crack detection down to a bending radius of 1 mm was observed.
Key words: RF-ID tag, flexible substrate, substrate transfer technology, ultra-thin substrate.
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