IWLPC (Wafer-Level Packaging) Conference Proceedings


WLP AND THE DRIVERS FOR THE CONVERGENCE OF FAB AND ASSEMBLY PROCESSING

Author: E. Jan Vardaman
Company: TechSearch International, Inc.
Date Published: 11/3/2005   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Historically, the semiconductor fabrication process ended with the formation of a multitude of die on a wafer with the next steps in the process called back-end assembly. There was a clear end to the front-end process steps and the start of the back-end process steps. Today the distinction is not so clear. The industry is experiencing a new dynamic with a convergence of front-end wafer processing and back-end assembly and the pace is accelerating rapidly.

An increasing number of devices, from diodes to DRAMs, are shipping as wafer level packages—all fabricated while the die is still in wafer form before dicing. What is driving this rapid growth in packaging at the wafer level and the convergence of what was once two distinct processing regions? This paper examines the drivers for wafer level packaging and future trends in the technology.

Key words: WLP, redistribution, bumping



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