WLP AND THE DRIVERS FOR THE CONVERGENCE OF FAB AND ASSEMBLY PROCESSINGAuthor: E. Jan Vardaman
Company: TechSearch International, Inc.
Date Published: 11/3/2005 Conference: IWLPC (Wafer-Level Packaging)
An increasing number of devices, from diodes to DRAMs, are shipping as wafer level packages—all fabricated while the die is still in wafer form before dicing. What is driving this rapid growth in packaging at the wafer level and the convergence of what was once two distinct processing regions? This paper examines the drivers for wafer level packaging and future trends in the technology.
Key words: WLP, redistribution, bumping
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