IWLPC (Wafer-Level Packaging) Conference Proceedings


MULTICOMPONENT IC PACKAGING

Authors: Sandra L. Winkler
Company: Electronic Trend Publications
Date Published: 11/3/2005   Conference: IWLPC (Wafer-Level Packaging)


Abstract: The semiconductor industry is a robust industry, despite its cyclical nature. Growing even faster are multicomponent packages, 3D stacked packages and SiPs. These packages go inside handheld products such as cellular telephones, offering space savings on the PCB and superior electrical performance. Increasingly cellular telephones are including these multicomponent packages, and cellular telephones are themselves experiencing a healthy growth rate, of 11.3 % CAGR through 2009. This all adds up to a positive market for 3D stacked packages and SiPs.

The semiconductor industry, while it experiences periodical swings and cycles, is still a robust business. The IC packaging market will experience a healthy compound annual growth rate (CAGR) of 9.3 percent for the years 2005 through 2009. Electronics have become very prevalent in our lives; more products are electronics driven, and some products, such as automobiles, continue to add more features that require more ICs. It does not take a “killer application” to pull the industry out of a trough; there are plenty of applications currently on the market to continue bringing long term growth to the industry.

Key Words: IC packaging, stacked packages, SiPs



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