MULTICOMPONENT IC PACKAGINGAuthors: Sandra L. Winkler
Company: Electronic Trend Publications
Date Published: 11/3/2005 Conference: IWLPC (Wafer-Level Packaging)
The semiconductor industry, while it experiences periodical swings and cycles, is still a robust business. The IC packaging market will experience a healthy compound annual growth rate (CAGR) of 9.3 percent for the years 2005 through 2009. Electronics have become very prevalent in our lives; more products are electronics driven, and some products, such as automobiles, continue to add more features that require more ICs. It does not take a “killer application” to pull the industry out of a trough; there are plenty of applications currently on the market to continue bringing long term growth to the industry.
Key Words: IC packaging, stacked packages, SiPs
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