A PRACTICAL ELECTROLYTE FOR THE ELECTRODEPOSITION OF EUTECTIC GOLD-TIN ALLOYAuthor: Prof. George Hradil
Company: Technic Inc.
Date Published: 11/3/2005 Conference: IWLPC (Wafer-Level Packaging)
Prior art electroplating baths for the deposition of Gold-Tin alloy have been found to be incapable of depositing the eutectic alloy over a usable current density range and have suffered from poor solution stability. As a result, these processes have limited commercial application.
An electroplating bath has now been developed which can deposit the eutectic Gold-Tin alloy over a practical current density range while maintaining very tight alloy control. Additionally, stability problems have been addressed, allowing extended electrolyte operation.
The current work reports on the electrolyte operating parameters and their influence on the deposit composition and morphology. Results for typical applications, such as back side wafer plating and bump plating, are presented.
Key words: Gold, Tin, eutectic, alloy, plating
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