Pan Pacific Symposium Conference Proceedings


REQUIREMENTS FOR MOISTURE AND THERMAL-SHOCK RESISTANCE OF A PLASTIC BGA PACKAGE

Author: Teo Poi Siong
Company: Singapore Institute of Microel
Date Published: 1/25/2000   Conference: Pan Pacific Symposium


Seika Machinery, Inc.

Abstract: This work identified requirements of molding compound and die-attach materials for the moisture and thermal shock resistance of a Plastic Ball Grid Array package. The test vehicle used was a 35x35mm molded wirebond PBGA assembled on 2-layer BT substrate.

The PBGA assembled using different combinations of die attach adhesive and molding compound was observed to have different moisture and thermal shock performance.

Analysis showed that molding compound had a stronger influence on the moisture resistance of the PBGA than the die attach adhesive. Moisture resistance of the package was improved by using molding compound with low modulus at peak reflow temperature, low saturated moisture concentration and low moisture diffusivity.

For thermal shock resistant, die attach adhesive showed a stronger influence than the molding compound. For an enhanced performance, the die attach adhesive should possess a low modulus over the temperature range of 25 to 150C.

Key words : BGA, moisture sensitivity, thermal shock



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819