Pan Pacific Symposium Conference Proceedings


Author: Teo Poi Siong
Company: Singapore Institute of Microel
Date Published: 1/25/2000   Conference: Pan Pacific Symposium

Seika Machinery, Inc.

Abstract: This work identified requirements of molding compound and die-attach materials for the moisture and thermal shock resistance of a Plastic Ball Grid Array package. The test vehicle used was a 35x35mm molded wirebond PBGA assembled on 2-layer BT substrate.

The PBGA assembled using different combinations of die attach adhesive and molding compound was observed to have different moisture and thermal shock performance.

Analysis showed that molding compound had a stronger influence on the moisture resistance of the PBGA than the die attach adhesive. Moisture resistance of the package was improved by using molding compound with low modulus at peak reflow temperature, low saturated moisture concentration and low moisture diffusivity.

For thermal shock resistant, die attach adhesive showed a stronger influence than the molding compound. For an enhanced performance, the die attach adhesive should possess a low modulus over the temperature range of 25 to 150C.

Key words : BGA, moisture sensitivity, thermal shock

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