SMTA International Conference Proceedings


ACCELERATION FACTORS AND THERMAL CYCLING TEST EFFICIENCY FOR LEAD-FREE SN-AG-CU ASSEMBLIES

Author: Jean-Paul Clech
Company: EPSI Inc.
Date Published: 9/25/2005   Conference: SMTA International


Abstract: This paper reports on the development and application of a SAC thermal cycling solder joint reliability model. The strain-energy based model is used to study the effect of ramp rates, mean temperature, dwell times and temperature profile (sine vs. trapeze-like cycle) on SAC solder joint life. The model captures dwell time effects accurately.

A detailed study of dwell time and ramp rate effects shows how accelerated thermal cycling profiles can be optimized to improve test efficiency. Other application examples illustrate the impact of component parameters - global mismatch in Coefficients of Thermal Expansion (CTEs) and maximum Distance to Neutral Point (DNP) - on acceleration factors.

Key words: Lead-free solder joint reliability, SAC life prediction model, dwell time, mean temperature, ramp rate effects, acceleration factors and their component dependency.



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