ACCELERATION FACTORS AND THERMAL CYCLING TEST EFFICIENCY FOR LEAD-FREE SN-AG-CU ASSEMBLIESAuthor: Jean-Paul Clech
Company: EPSI Inc.
Date Published: 9/25/2005 Conference: SMTA International
A detailed study of dwell time and ramp rate effects shows how accelerated thermal cycling profiles can be optimized to improve test efficiency. Other application examples illustrate the impact of component parameters - global mismatch in Coefficients of Thermal Expansion (CTEs) and maximum Distance to Neutral Point (DNP) - on acceleration factors.
Key words: Lead-free solder joint reliability, SAC life prediction model, dwell time, mean temperature, ramp rate effects, acceleration factors and their component dependency.
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