RELIABILITY EVALUATION OF LEAD-FREE SNAGCU PBGA676 COMPONENTS USING TIN-LEAD AND LEAD-FREE SNAGCU SOLDER PASTEAuthor: Jasbir Bath et al.
Company: Solectron Corporation
Date Published: 9/25/2005 Conference: SMTA International
This paper will present the work of the ATC reliability evaluations comparing the standard IPC short dwell accelerated thermal cycling condition with the recently proposed extended dwell condition for lead-free SnAgCu soldered SnAgCu PBGA components. ATC results for tinlead solder paste with lead-free PBGA components will also be presented using two solder peak temperatures, 205°C and 214°C. The data will include visual, X-ray, dye penetrant/cross sectioning, failure analysis and Weibull plots.
Key words: Lead-free, ATC Reliability, Bend Test reliability, Backward compatibility
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