SMTA International Conference Proceedings


RELIABILITY EVALUATION OF LEAD-FREE SNAGCU PBGA676 COMPONENTS USING TIN-LEAD AND LEAD-FREE SNAGCU SOLDER PASTE

Author: Jasbir Bath et al.
Company: Solectron Corporation
Date Published: 9/25/2005   Conference: SMTA International


Abstract: A team of companies collaborated in a Lead-free Working Group project to evaluate the assembly and reliability of lead-free SnAgCu PBGA676 components with tin-lead and lead-free SnAgCu solder paste on a 93mil thick test vehicle. Reliability evaluations included Accelerated Thermal Cycling (ATC) from 0 to 100°C with 2 dwell time durations at the high temperature 100°C extreme: the usual short dwell duration of 10 minutes and a long dwell duration of 60 minutes. Certain assembled test cells were also bend tested for mechanical solder joint reliability evaluations.

This paper will present the work of the ATC reliability evaluations comparing the standard IPC short dwell accelerated thermal cycling condition with the recently proposed extended dwell condition for lead-free SnAgCu soldered SnAgCu PBGA components. ATC results for tinlead solder paste with lead-free PBGA components will also be presented using two solder peak temperatures, 205°C and 214°C. The data will include visual, X-ray, dye penetrant/cross sectioning, failure analysis and Weibull plots.

Key words: Lead-free, ATC Reliability, Bend Test reliability, Backward compatibility



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