AN ACCELERATION MODEL FOR Sn-Ag-Cu SOLDER JOINT RELIABILITY UNDER VARIOUS THERMAL CYCLE CONDITIONSAuthor: N. Pan et al.
Company: Hewlett-Packard Co.
Date Published: 9/25/2005 Conference: SMTA International
In this study, accelerated thermal cycle (ATC) testing was performed using several thermal cycle profiles, in which the temperature range (.T), maximum temperature (Tmax), and dwell time (td) or cycle frequency (f) were systematically varied. These various cycle profiles were used to perform solder joint reliability tests for three different types of electronic packages: 2533-CBGAs, 60-CSPs, and 52-TSOPs. These Pb-free packages were assembled to the printed circuit board using Sn-Ag-Cu solder, producing entirely Pb-free joints.
Data from these experiments were analyzed using 2-parameter Weibull statistics, and the characteristic life from each set of experiments was determined. These data were used to evaluate the constants in the well-known Norris-Landzberg acceleration model. The differences between the constants for SAC solder from those for eutectic Sn-Pb solder are discussed.
Key words: SAC solder, reliability, acceleration model
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