SMTA International Conference Proceedings


A COMPARISON OF CLEANING TECHNOLOGIES FOR NEW LEAD-FREE SOLDER PASTE FORMULATIONS

Authors: John R. Sanders et al.
Company: Petroferm Inc.
Date Published: 9/25/2005   Conference: SMTA International


Abstract: The upcoming enactment of the Restriction of Hazardous Substances (RoHS) Directive requires the elimination of lead from electronics assemblies. The move to lead-free changes soldering process conditions and solder paste formulations significantly. A study was initiated to understand the post reflow flux residues cleaning capability of multiple aqueous, semi-aqueous, vapor degreasing, cosolvent vapor degreasing and solvent cleaning processes on these new lead-free solder paste formulations.

Twenty two no-clean and water washable lead-free solder pastes from multiple suppliers were evaluated and results were compared to those found of fifteen leaded eutectic materials. Cleanliness was assessed by visual inspection and ionic contamination testing.

Key Words: Lead-free, cleaning, aqueous, semi-aqueous, solvent, vapor degreasing



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