SMTA International Conference Proceedings


JCAA/JG-PP NO-LEAD SOLDER PROJECT: -20ºC TO +80ºC and -55ºC TO +125ºC THERMAL CYCLE TESTING

Author: David D. Hillman
Company: Rockwell Collins Inc.
Date Published: 9/25/2005   Conference: SMTA International


Abstract: The use of conventional tin-lead (Sn/Pb) solder in circuit board manufacturing is under ever-increasing political scrutiny due to environmental issues and increasing regulations concerning lead, such as the Waste Electrical and Electronic Equipment (WEEE) and the Restriction on Hazardous Substances (RoHS) Directives in Europe. Many global commercial grade electronic manufacturers are initiating efforts to transition to lead free. Lead-free (Pbfree) materials will be finding their way into the inventory of aerospace and military assembly processes under government acquisition reform initiatives.

Any potential banning of lead compounds could reduce the supplier base and adversely affect the readiness of missions led by NASA and the DoD. The Joint Council on Aging Aircraft (JCAA)/ Joint Group on Pollution Prevention (JGPP) Lead-Free Solder Project, a partnership between DoD, NASA and OEMs, was initiated to examine the reliability of lead-free solders exposed to harsh environmental conditions representative of NASA and DoD operational conditions. This paper reports on the JCAA/JGPP consortia -55ºC to +125ºC and -20ºC to +80ºC thermal cycle testing. The main goal of the thermal cycle testing effort is to generate data from test boards that are representative of IPC Class III High Performance Electronic Products.

Key words: Thermal cycling, lead-free solders, reliability



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