Pan Pacific Symposium Conference Proceedings


CSP SMT AND SOLDER JOINT RELIABILITY

Author: Pei-Ying Shieh
Company: Computer and Communication Lab
Date Published: 1/25/2000   Conference: Pan Pacific Symposium


Abstract: The reliability problem of chip scale packaging (CSP) after assembled with printed circuit board (PCB) has become a major issue in the electronic packaging industry. In this paper, several types of CSP packages are used to evaluate the solder joint reliability by several board level reliability tests such as temperature cycle test, sine wave vibration test, variable frequency vibration test, mechanical shock test, three point bending test and four point twisting test. The investigation of SMT parameters includes the effects of the stencil opening, surface finish, solder paste and solder ball. The temperature cycle test and variable frequency vibration test are performed for the SMT parameter study. For temperature cycle test, the temperature ranges from -40℃ to 125℃ and the dwell time is 10 minutes. In the variable frequency vibration test, the frequency ranges from 20 Hz to 2000 Hz. The test results are different under variety of reliability tests.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819