Pan Pacific Symposium Conference Proceedings


Author: Pei-Ying Shieh
Company: Computer and Communication Lab
Date Published: 1/25/2000   Conference: Pan Pacific Symposium

Abstract: The reliability problem of chip scale packaging (CSP) after assembled with printed circuit board (PCB) has become a major issue in the electronic packaging industry. In this paper, several types of CSP packages are used to evaluate the solder joint reliability by several board level reliability tests such as temperature cycle test, sine wave vibration test, variable frequency vibration test, mechanical shock test, three point bending test and four point twisting test. The investigation of SMT parameters includes the effects of the stencil opening, surface finish, solder paste and solder ball. The temperature cycle test and variable frequency vibration test are performed for the SMT parameter study. For temperature cycle test, the temperature ranges from -40℃ to 125℃ and the dwell time is 10 minutes. In the variable frequency vibration test, the frequency ranges from 20 Hz to 2000 Hz. The test results are different under variety of reliability tests.

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