SMTA International Conference Proceedings


SALT ATMOSPHERE, TEMPERATURE HUMIDITY, AND MECHANICAL SHOCK ENVIRONMENTAL STRESS TESTING RESULTS OF THE JG-PP / JCAA LEAD FREE SOLDERING PROGRAM

Author: Lee Whiteman
Company: American Competitiveness Inst.
Date Published: 9/25/2005   Conference: SMTA International


Abstract: The American Competitiveness Institute (ACI) performed a series of Environmental Stress Tests for the Joint Group of Pollution Prevention / Joint Council of Aging Aircraft (JGPP / JCAA) Lead Free Soldering Program. The objective was to determine if Lead Free soldered hardware was equivalent to or better than its Tin Lead (SnPb) counterpart. The program’s test vehicle was manufactured by BAE Systems in Irvine, Texas. The JG-PP / JCAA test vehicle was soldered with Tin Lead (SnPb) as a baseline, Tin Silver Copper (95.5Sn3.9Ag0.6Cu or SAC), Tin Silver Copper Bismuth ((92.3Sn3.4Ag1.0Cu3.3Bi or SACB), and stabilized Tin Copper (99.3Sn0.7Cu0.05Ni).

The Salt Atmosphere test was performed in accordance to ASTM B117 Test Method for 48 hours. The Temperature Humidity test followed the procedure MIL-STD 810F; Test Method 507.4. In both tests, no failures were found that could be attributed to the solder joints. Therefore, the Tin Lead and Lead Free soldered hardware can be considered equivalent. Two types of Mechanical Shock tests were performed.

The first Mechanical Shock test was performed using the test procedure MIL-STD 810F; Method 516.5; Procedure 1. The test was performed on all 3 axes. 2 components soldered with SACB failed the tests. The balance of the SnPb and Lead Free soldered components passed this mechanical shock test with no failures.

The second Mechanical Shock test was performed to a modified version of MIL-STD 810F; Method 516.5; Procedure 1, where the test vehicle was tested in the Z-Direction, at increasing levels to failure. The mechanical shock levels reached in this test were above those in the first mechanical shock test. Across all test levels and component types, the SnPb soldered hardware performed better than the SAC and the SACB soldered hardware.

Keywords: JG-PP, JCAA, Lead Free Soldering, Reliability Testing



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