JCAA/JG-PP NO-LEAD SOLDER PROJECT: THERMAL SHOCK TESTAuthors: Thomas A. Woodrow, Ph.D.
Company: Boeing Phantom Works
Date Published: 9/25/2005 Conference: SMTA International
Sn3.9Ag0.6Cu for reflow and wave soldering
Sn3.4Ag1.0Cu3.3Bi for reflow soldering
Sn0.7Cu0.05Ni for wave soldering
Sn37Pb for reflow and wave soldering
Test vehicles were assembled using these solders and a variety of component types. Thermal shock cycling was then conducted on the test vehicles using a system with dual chambers. The hot chamber was held at 125°C and the cold chamber was held at -55°C. The dwell time in each chamber was 15 minutes and the duration of each test was 1000 cycles.
The solder joints on the components were electrically monitored using event detectors and any solder joint failures were recorded on a Labview-based data collection system. The failures of a given component type attached with SnPb solder were then compared to the failures of the same component type attached with lead-free solders by using Weibull analysis.
Key words: Thermal shock, lead-free solders, reliability
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