SMTA International Conference Proceedings


Author: Matthew T. Holzmann
Company: Christopher Associates Inc.
Date Published: 9/25/2005   Conference: SMTA International

Abstract: The sheer volume of data generated by automatic optical inspection systems, combined with the requirement to accurately and properly verify and classify defects presents a significant challenge in its implementation as a real time process control tool. Simple, accurate and immediate feedback is necessary to allow for the process adjustments necessary to maintain SMT placement line performance.

Volumetric solder paste inspection (SPI) has significant potential in achieving process yield improvements. Phase shift interferometry has allowed for greater measurement accuracy and proper defect classification at higher throughput rates. More accurate management of the solder paste printing process can be realized with an immediate reduction in paste related defects.

Key words: Phase shift interferometry, 3D SPI, AOI, Solder Paste Inspection.

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