PROCESS CONTROL THROUGH VOLUMETRIC OPTICAL INSPECTIONAuthor: Matthew T. Holzmann
Company: Christopher Associates Inc.
Date Published: 9/25/2005 Conference: SMTA International
Volumetric solder paste inspection (SPI) has significant potential in achieving process yield improvements. Phase shift interferometry has allowed for greater measurement accuracy and proper defect classification at higher throughput rates. More accurate management of the solder paste printing process can be realized with an immediate reduction in paste related defects.
Key words: Phase shift interferometry, 3D SPI, AOI, Solder Paste Inspection.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.